ABOUT DFxEngineering
DFxEngineering provides mechanical and thermal engineering design services to OEMs for the development of thermal management and mechanical packaging solutions. Formerly the consulting group of Advanced Thermal Solutions, DFxEngineering is now a division of ATS, Inc.
Drawing from over 30 years of experience in the electronics cooling industry, DFxEngineering provides users with a deep set of skills to solve the toughest mechanical and thermal engineering challenges.
Custom Thermal Engineering
Our experienced team has designed a wide variety of custom solutions including:
- Custom cold plates (finned, tubed and jet.)
- Heat sinks with embedded heat pipes or vapor chambers
- Complete liquid loop
- Custom vapor chambers
- Heat sinks with various materials such as copper bases, fin geometries and materials,
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Custom Cooling Solutions
All DFxEngineering custom designs meet strict criteria for an effective solution.
- Prototyping – All models are developed and tested in our facilities
- Manufacturability – Certified to ISO 9001 standards
- Long-term quality – Every part is inspected to spec
- Safety – We identify all installation needs
- Cost effectiveness – Solutions are within designated customer budget
Lab Capabilities
DFxEngineering’s Thermal Characterization Lab offers cutting-edge testing capabilities.
- Semiconductor characterization, temperature measurement, velocity and pressure analysis, fan characterization, and more
- Benefit from unique equipment like water tunnels and surface thermography systems for precise analysis
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PCB Layout & Design
PCB layout and design services for optimizing thermal management in circuit board designs.
- Benefit from CFD studies, wind tunnel testing, and computational simulations to ensure reliability and reduce costs.
- Enhance cooling efficiency with DFxEngineering’s expertise in improving airflow overpopulated boards and resolving thermal problems
Testing & Validation
DFxEngineering tests cooling methods in extreme temperature conditions. This ensures their proper performance in real conditions.
- JEDEC-certified testing facility
- Environmental chambers
- Rack-level chamber with –40°C to 100°C temperature range
- Multi-bay testing up to 85°C
Chassis Design & Systems Integration
DFxEngineering develops custom chassis and housing designs across industries. Among the chassis we have thermally enhanced for electronics cooling:
- ATCA chassis with 4.5kW cooling capacity
- IOT and set-top boxes with optimized air cooling
- High capacity 1U chassis with enhanced internal cooling via jet impingement
Heat Pipe & Vapor Chamber Design
DFxEngineering custom-designs and produces heat pipes and vapor chambers optimized to a customers’ applications.
- Heat pipes in round or square profile copper
- Heat pipes pre-assembled to heat spreaders
- Vapor chambers in aluminum, copper, or titanium
- Vapor chambers with choices of internal mesh and fluids
Liquid Cooling System Design
When air cooling is insufficient, DFxEngineering identifies the liquid cooling solution required at the analysis stage. The benefits of this expert analysis include:
- Fewer design iterations and simulations
- Complete scheme of liquid loop components and their system integration
- Material options to match a cooling system to design requirements